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S29GL128M Datasheet(PDF) 12 Page - SPANSION |
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S29GL128M Datasheet(HTML) 12 Page - SPANSION |
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12 / 116 page  10 S29GL-M MirrorBitTM Flash Family S29GL-M_00_B6 October 10, 2006 Data Sheet For S29GL064M (model R0) only Special Package Handling Instructions Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The package and/or data integrity may be compromised if the package body is exposed to tempera- tures above 150°C for prolonged periods of time. C2 D2 C3 D3 E2 E3 F2 F3 G2 G3 H2 H3 J2 J3 K2 A3 A4 A2 A1 A0 CE# OE# VSS A7 A18 A6 A5 DQ0 NC NC DQ1 RY/BY# ACC NC NC DQ2 DQ3 VIO A21 WE# RESET# A22 NC DQ5 NC VCC DQ4 A9 A8 A11 A12 A19 A10 DQ6 DQ7 A14 A13 A15 A16 A17 NC A20 VSS C4 D4 E4 A1 B1 A2 NC* NC* NC* F4 G4 H4 J4 K4 C5 D5 E5 F5 G5 H5 J5 K5 C6 D6 E6 F6 G6 H6 J6 K6 C7 D7 E7 NC* NC* NC* NC* A7 B7 A8 B8 F7 G7 H7 J7 K7 NC* NC* NC* NC* L7 M7 L8 M8 K3 L1 L2 M1 NC* NC* NC* NC* M2 * Balls are shorted together via the substrate but not connected to the die. 63-Ball Fine-Pitch BGA Top View, Balls Facing Down |
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