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BLF246 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BLF246 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 1996 Oct 21 3 Philips Semiconductors Product specification VHF power MOS transistor BLF246 LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage − 65 V VGS gate-source voltage −±20 V ID DC drain current − 13 A Ptot total power dissipation up to Tamb =25 °C − 130 W Tstg storage temperature −65 150 °C Tj junction temperature − 200 °C SYMBOL PARAMETER VALUE UNIT Rth j-mb thermal resistance from junction to mounting base 1.35 K/W Rth mb-h thermal resistance from mounting base to heatsink 0.2 K/W Fig.2 DC SOAR. (1) Current is this area may be limited by RDS(on). (2) Tmb =25 °C. handbook, halfpage 10−1 102 1 10 110 (1) 50 ID (A) VDS (V) MRA931 (2) Fig.3 Power derating curves. (1) Continuous operation. (2) Short-time operation during mismatch. handbook, halfpage 0 50 100 150 200 150 50 0 100 MGG104 Ptot (W) Th (°C) (1) (2) |
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