September 1992

10

Philips Semiconductors

Product specification

VHF push-pull power MOS transistor

BLF248

Fig.12 Component layout for 225 MHz class-AB test circuit.

The circuit and components are situated on one side of the printed circuit board, the other side being fully

metallized, to serve as a ground plane. Earth connections are made by means of copper straps and hollow rivets.

Dimensions in mm.

handbook, full pagewidth

130

MGP213

C18

C13

L12

R7

L12

C12

C16

C17

+VDD1

L13

hollow rivet

C25

C23

C24

L18

L19

C27

L20

C28

L21

C30

C26

L17

L16

L10

L11

C22

L14

C19

C14

C15

C21

C20

copper strap

L23

L24

hollow rivets

L15

R8

L15

+VDD2

L22

C29

+VDD1

IC1

to R1, R6

C31

C32

C33

C8

R2

slider R1

C9

C6

R3

C5

C1

C3

C2

L5

L4

C4

L6

L7

R4

L8

L9

C7

C10

R5

C11

C34

slider R6

L3

hollow rivets

L2

copper strap

119

100

R9

L1