2.00

(0.079)

1

2

3

4

5

6

7

8

9

10

11

12

13

0.82

(0.032)

1.22

(0.048)

1.62

(0.064)

2.42

(0.095)

3.22

(0.127)

2.82

(0.111)

2.42

(0.095)

1.62

(0.064)

1.22

(0.048)

0.82

(0.032)

0.0

0.0

1.00

(0.039)

14

2.82

(0.111)

3.22

(0.127)

1.00

(0.039)

3.70

(0.146)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

RF

In

RF

Out

Vg3

Vg2

Vg1

Vd1

Vd2

Vd3

Mechanical Drawing

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note: Engineering designator is 30SPA0557)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.588 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vg1A)

Bond Pad #3 (Vd1A)

Bond Pad #4 (Vg2A)

Bond Pad #5 (Vd2A)

Bond Pad #6 (Vg3A)

Bond Pad #7 (Vd3A)

Bond Pad #8 (RF Out)

Bond Pad #9 (Vd3B)

Bond Pad #10 (Vg3B)

Bond Pad #11 Vd2B)

Bond Pad #12 (Vg2B)

Bond Pad #13 (Vd1B)

Bond Pad #14 (Vg1B)

Page 3 of 5

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©

2005 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

30SPA0553

27.0-32.0 GHz GaAs MMIC

Power Amplifier

September 2005 - Rev 01-Sep-05