| Electronic Components Datasheet Search |
|
ISL6545IBZ Datasheet(PDF) 10 Page - Renesas Technology Corp |
|
|
|||||||||||||||||||||||||||||
ISL6545IBZ Datasheet(HTML) 10 Page - Renesas Technology Corp |
|
10 / 17 page ![]() ISL6545, ISL6545A FN6305 Rev 7.00 Page 10 of 17 October 7, 2015 sense resistor), the regular boot refresh circuit will still be active. Current Sinking The ISL6545x incorporates a MOSFET shoot-through protection method which allows a converter to sink current as well as source current. Care should be exercised when designing a converter with the ISL6545x when it is known that the converter may sink current. When the converter is sinking current, it is behaving as a boost converter that is regulating its input voltage. This means that the converter is boosting current into the VCC rail, which supplies the bias voltage to the ISL6545x. If there is nowhere for this current to go, such as to other distributed loads on the VCC rail, through a voltage limiting protection device, or other methods, the capacitance on the VCC bus will absorb the current. This situation will allow voltage level of the VCC rail to increase. If the voltage level of the rail is boosted to a level that exceeds the maximum voltage rating of the ISL6545x, then the IC will experience an irreversible failure and the converter will no longer be operational. Ensuring that there is a path for the current to follow other than the capacitance on the rail will prevent this failure mode. Application Guidelines Layout Considerations As in any high frequency switching converter, layout is very important. Switching current from one power device to another can generate voltage transients across the impedances of the interconnecting bond wires and circuit traces. These interconnecting impedances should be minimized by using wide, short printed circuit traces. The critical components should be located as close together as possible, using ground plane construction or single point grounding. Figure 7 shows the critical power components of the converter. To minimize the voltage overshoot, the interconnecting wires indicated by heavy lines should be part of a ground or power plane in a printed circuit board. The components shown should be located as close together as possible. Please note that the capacitors CIN and CO may each represent numerous physical capacitors. For best results, locate the ISL6545x within 1 inch of the MOSFETs, Q1 and Q2. The circuit traces for the MOSFET gate and source connections from the ISL6545x must be sized to handle up to 1A peak current. Figure 8 shows the circuit traces that require additional layout consideration. Use single point and ground plane construction for the circuits shown. Minimize any leakage current paths on the COMP/SD pin and locate the resistor, ROSCET close to the COMP/SD pin because the internal current source is only 20µA. Provide local VCC decoupling between VCC and GND pins. Locate the capacitor, CBOOT as close as practical to the BOOT and PHASE pins. All components used for feedback compensation (not shown) should be located as close to the IC as practical. Feedback Compensation This section highlights the design consideration for a voltage-mode controller requiring external compensation. To address a broad range of applications, a type-3 feedback network is recommended, as shown in the top part of Figure 9. Figure 9 also highlights the voltage-mode control loop for a synchronous-rectified buck converter, applicable to the ISL6545x circuit. The output voltage (VOUT) is regulated to the reference voltage, VREF. The error amplifier output (COMP pin voltage) is compared with the oscillator (OSC) modified sawtooth wave to provide a pulse-width modulated wave with an amplitude of VIN at the PHASE node. The PWM wave is smoothed by the output filter (L and C). The output filter capacitor bank’s equivalent series resistance is represented by the series resistor E. LO CO LGATE/OCSET UGATE PHASE Q1 Q2 VIN VOUT RETURN ISL6545, CIN FIGURE 7. PRINTED CIRCUIT BOARD POWER AND GROUND PLANES OR ISLANDS ISL6545A FIGURE 8. PRINTED CIRCUIT BOARD SMALL SIGNAL LAYOUT GUIDELINES +VCC ISL6545, LGATE/OCSET GND VCC BOOT LO CO VOUT Q1 Q2 PHASE +VIN CBOOT CVCC ISL6545A ISL6545, ISL6545A |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |