NXP Semiconductors

MF4SAM3x

MIFARE SAM AV3 secure access module

3 Ordering information

Package

Type number

Name

Description

Version

MF4SAM3U15/9BA659

wafer

unbumped

150 µm thickness sawn wafer on film frame carrier (FFC)

NAU000

MF4SAM3HN/9BA659

HVQFN32

plastic thermal enhanced very thin quad flat package; no leads;

32 terminals; body 5 x 5 x 0.85 mm; reel pack; minimum order

quantity: 6.000

SOT617-3

MF4SAM3X84/9BA659

PCM1.5 [1]

contact chip card module (super 35 mm tape format, 8 contact),

minimum order quantity: 11.900

SOT658-1

Table 1. Ordering information

[1]

NXP Semiconductors is ending the internal PCM1.5 manufacturing of 8-pin contact modules. For more information please contact your sales

representative.

MF4SAM3X_SDS

All information provided in this document is subject to legal disclaimers.

© 2023 NXP B.V. All rights reserved.

Product short data sheet

Rev. 3.1 — 1 July 2023

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