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BSH104 Datasheet(PDF) 4 Page - NXP Semiconductors

Part # BSH104
Description  N-channel enhancement mode MOS transistor
PDF  8 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BSH104 Datasheet(HTML) 4 Page - NXP Semiconductors

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1997 Nov 26
4
Philips Semiconductors
Objective specification
N-channel enhancement mode
MOS transistor
BSH104
CHARACTERISTICS
Tj =25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V(BR)DSS
drain-source breakdown voltage
VGS = 0; ID =10 µA12
−−
V
VGSth
gate-source threshold voltage
VGS =VDS; ID = 1 mA
0.4
−−
V
IDSS
drain-source leakage current
VGS = 0; VDS = 9.6 V
−−
100
nA
IGSS
gate leakage current
VDS = 0; VGS = ±8V
−−±100 nA
RDSon
drain-source on-state resistance
VGS = 4.5 V; ID = 0.65 A
−−
0.23
Ω
VGS = 2.5 V; ID = 0.65 A
−−
0.3
Ω
VGS = 1.8 V; ID = 0.32 A
−−
0.4
Ω
Ciss
input capacitance
VGS = 0; VDS = 9.6 V; f = 1 MHz
−
t.b.f.
−
pF
Coss
output capacitance
VGS = 0; VDS = 9.6 V; f = 1 MHz
−
t.b.f.
−
pF
Crss
reverse transfer capacitance
VGS = 0; VDS = 9.6 V; f = 1 MHz
−
t.b.f.
−
pF
QG
total gate charge
VGS =6V; VDD =6V; ID = 0.65 A;
Tamb =25 °C
−
t.b.f.
−
pC
QGS
gate-source charge
VDD =6V; ID = 0.65 A;
Tamb =25 °C
−
t.b.f.
−
pC
QGD
gate-drain charge
VDD =6V; ID = 0.65 A;
Tamb =25 °C
−
t.b.f.
−
pC
Switching times
td(on)
turn-on delay time
VGS = 0 to 6 V; VDD =6V;
ID = 0.65 A; Rgen =6 Ω
−
t.b.f.
−
ns
tf
fall time
VGS = 0 to 6 V; VDD =6V;
ID = 0.65 A; Rgen =6 Ω
−
t.b.f.
−
ns
ton
turn-on switching time
VGS = 0 to 6 V; VDD =6V;
ID = 0.65 A; Rgen =6 Ω
−
t.b.f.
−
ns
td(off)
turn-off delay time
VGS = 6 to 0 V; VDD =6V;
ID = 0.65 A; Rgen =6 Ω
−
t.b.f.
−
ns
tr
rise time
VGS = 6 to 0 V; VDD =6V;
ID = 0.65 A; Rgen =6 Ω
−
t.b.f.
−
ns
toff
turn-off switching time
VGS = 6 to 0 V; VDD =6V;
ID = 0.65 A; Rgen =6 Ω
−
t.b.f.
−
ns
Source-drain diode
VSD
source-drain diode forward voltage
VGD = 0; IS = 0.5 A
−−
1V
trr
reverse recovery time
IS = 0.5 A; di/dt = −100 A/µs
−
t.b.f.
−
ns



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