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BSH104 Datasheet(PDF) 4 Page - NXP Semiconductors |
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BSH104 Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 8 page ![]() 1997 Nov 26 4 Philips Semiconductors Objective specification N-channel enhancement mode MOS transistor BSH104 CHARACTERISTICS Tj =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)DSS drain-source breakdown voltage VGS = 0; ID =10 µA12 −− V VGSth gate-source threshold voltage VGS =VDS; ID = 1 mA 0.4 −− V IDSS drain-source leakage current VGS = 0; VDS = 9.6 V −− 100 nA IGSS gate leakage current VDS = 0; VGS = ±8V −−±100 nA RDSon drain-source on-state resistance VGS = 4.5 V; ID = 0.65 A −− 0.23 Ω VGS = 2.5 V; ID = 0.65 A −− 0.3 Ω VGS = 1.8 V; ID = 0.32 A −− 0.4 Ω Ciss input capacitance VGS = 0; VDS = 9.6 V; f = 1 MHz − t.b.f. − pF Coss output capacitance VGS = 0; VDS = 9.6 V; f = 1 MHz − t.b.f. − pF Crss reverse transfer capacitance VGS = 0; VDS = 9.6 V; f = 1 MHz − t.b.f. − pF QG total gate charge VGS =6V; VDD =6V; ID = 0.65 A; Tamb =25 °C − t.b.f. − pC QGS gate-source charge VDD =6V; ID = 0.65 A; Tamb =25 °C − t.b.f. − pC QGD gate-drain charge VDD =6V; ID = 0.65 A; Tamb =25 °C − t.b.f. − pC Switching times td(on) turn-on delay time VGS = 0 to 6 V; VDD =6V; ID = 0.65 A; Rgen =6 Ω − t.b.f. − ns tf fall time VGS = 0 to 6 V; VDD =6V; ID = 0.65 A; Rgen =6 Ω − t.b.f. − ns ton turn-on switching time VGS = 0 to 6 V; VDD =6V; ID = 0.65 A; Rgen =6 Ω − t.b.f. − ns td(off) turn-off delay time VGS = 6 to 0 V; VDD =6V; ID = 0.65 A; Rgen =6 Ω − t.b.f. − ns tr rise time VGS = 6 to 0 V; VDD =6V; ID = 0.65 A; Rgen =6 Ω − t.b.f. − ns toff turn-off switching time VGS = 6 to 0 V; VDD =6V; ID = 0.65 A; Rgen =6 Ω − t.b.f. − ns Source-drain diode VSD source-drain diode forward voltage VGD = 0; IS = 0.5 A −− 1V trr reverse recovery time IS = 0.5 A; di/dt = −100 A/µs − t.b.f. − ns |
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