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© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 01 — 2 June 2005

14 of 19

Philips Semiconductors

GTL2007

13-bit GTL to LVTTL translator with power good control

14. Package outline

Fig 13. Package outline SOT361-1 (TSSOP28)

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

9.8

9.6

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.8

0.5

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT361-1

MO-153

99-12-27

03-02-19

0.25

Z

e

114

28

15

pin 1 index

θ

A

Q

detail X

L

(A )

3

E

c

X

A

D

y

0

2.5

5 mm

scale

TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm

SOT361-1

A

max.

1.1