© Koninklijke Philips Electronics N.V. 2005

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 2 June 2005

Document number: 9397 750 13264

Published in The Netherlands

Philips Semiconductors

GTL2007

13-bit GTL to LVTTL translator with power good control

23. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

4

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

5

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

6

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7

Functional description . . . . . . . . . . . . . . . . . . . 5

7.1

Function tables . . . . . . . . . . . . . . . . . . . . . . . . . 5

8

Application design-in information . . . . . . . . . . 7

9

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

10

Recommended operating conditions. . . . . . . . 8

11

Static characteristics. . . . . . . . . . . . . . . . . . . . . 9

12

Dynamic characteristics . . . . . . . . . . . . . . . . . 10

12.1

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13

Test information . . . . . . . . . . . . . . . . . . . . . . . . 13

14

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14

15

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

15.1

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

15.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15

15.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15

15.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16

15.5

Package related soldering information . . . . . . 16

16

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17

17

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17

18

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 18

19

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

20

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

21

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

22

Contact information . . . . . . . . . . . . . . . . . . . . 18