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BSR52 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BSR52 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 7 page ![]() 2004 Nov 11 3 Philips Semiconductors Product specification NPN Darlington transistor BSR52 THERMAL CHARACTERISTICS Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tamb =25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient note 1 150 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ICES collector-base cut-off current VBE = 0 V; VCE =80V −− 50 nA IEBO emitter-base cut-off current VEB =4V; IC =0 A −− 50 nA hFE DC current gain VCE = 10 V; see Fig.2 IC = 150 mA 1000 −− IC = 500 mA 2000 −− VCEsat collector-emitter saturation voltage IC = 0.5 A; IB = 0.5 mA −− 1.3 V IC = 1 A; IB =4mA −− 1.6 V VBEsat base-emitter saturation voltage IC = 0.5 A; IB = 0.5 mA −− 1.9 V IC = 1 A; IB =4mA −− 2.2 V fT transition frequency VCE =5V; IC = 500 mA; f = 100 MHz − 200 − MHz Switching times (between 10% and 90% levels); see Fig.3 ton turn-on time ICon = 500 mA; IBon = 0.5 mA; IBoff = −0.5 mA −− 500 ns toff turn-off time −− 1300 ns |
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