GP2S60

Fig.13 Relative Collector Current vs.OMS

Card Moving Distance

Fig.14 Relative Collector Current vs.OMS

Card Moving Distance

20

40

60

80

100

6

4

2

03

5

1

−3

−1

−2

OMS card moving distance (mm)

=2V

=4mA

d

=1mm

1mm

d

0

OMS test card

Sensor +−

Fig.15 Reflow Soldering

Max.120s

Max.90s

Max.60s

Max.10s

Max. 165

°C

Only one time soldering is available within the temperature profile

shown below.

200

°C

25

°C

Max. 240

°C

1 to 4˚C/s

1 to 4˚C/s

1 to 4˚C/s

Sensor

20

40

60

80

100

6

4

2

03

5

1

−3

−1

−2

OMS card moving distance (mm)

=2V

=4mA

d

=1mm

1mm

d

0

OMS test card

+−

I Other Precautions

An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package

temperature within that specified in Item 1. Also avoid immersing the resin part in the solder. Even if within the temperature

profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCW gives the

affection to lead pins. Please use after confirmation the conditions fully by actual solder reflow machine.