Data Sheet G17372EJ2V0DS

9

μ PC3033,3005

RECOMMENDED SOLDERING CONDITIONS

The

μPC3033,3005 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Through-hole devices

μPC3033H, μPC3005H: 4-pin plastic SIP (TO-126)

Process

Conditions

Recommend

Wave soldering

(only to leads)

Solder temperature: 260°C or below,

Flow time: 10 seconds or less.

WS60-00-1

Partial heating method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each pin).

P300

μPC3033H-AZ, μPC3005H-AZ: 4-pin plastic SIP (TO-126) Note

Process

Conditions

Recommend

Wave soldering

(only to leads)

Solder temperature: 260°C or below,

Flow time: 10 seconds or less.

WS60-00-1

Partial heating method

Pin temperature: 350°C or below,

Heat time: 3 seconds or less (Per each pin).

P350

Note Pb-free (This product does not contain Pb in external electrode.)

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.

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