UPD6P9 datasheet(39/45 Pages) RENESAS

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µPD6P9

Data Sheet U15144EJ1V1DS

10. RECOMMENDED SOLDERING CONDITIONS

The

µPD6P9 must be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Table 10-1. Surface Mounting Soldering Conditions

(1)

µPD6P9M1MC-5A4: 20-pin plastic SSOP (7.62 mm (300))

µPD6P9M3MC-5A4: 20-pin plastic SSOP (7.62 mm (300))

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrated reflow

Package peak temperature: 235

°C, Time: 30 seconds max. (at 210°C

IR35-103-2

or higher), Count: Two times or less, Exposure limit: 3 daysNote

(after that, prebake at 125

°C for 10 hours)

VPS

Package peak temperature: 215

°C, Time: 40 seconds max. (at 200°C

VP15-103-2

or higher), Count: Two times or less, Exposure limit: 3 daysNote

(after that, prebake at 125

°C for 10 hours)

Wave soldering

Solder bath temperature: 260

°C max, Time: 10 seconds max., Count: once,

WS60-103-1

preheating temperature: 120

°C max. (package surface temperature)

Exposure limit: 3 daysNote (after that, prebake at 125

°C for 10 hours)

Partial heating

Pin temperature: 350

°C max., Time: 3 seconds max. (per pin row)

–

Note After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

(2)

µPD6P9M1MC-5A4-A: 20-pin plastic SSOP (7.62 mm (300))

µPD6P9M3MC-5A4-A: 20-pin plastic SSOP (7.62 mm (300))

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrated reflow

Package peak temperature: 260

°C, Time: 60 seconds max. (at 220°C

IR60-103-3

or higher), Count: Three times or less, Exposure limit: 3 daysNote

(after that, prebake at 125

°C for 10 to 72 hours)

Wave soldering

For details, contact an NEC Electronics sales representative.

–

Partial heating

Pin temperature: 350

°C max., Time: 3 seconds max. (per pin row)

–

Note After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

Remark

Products that have the part numbers suffixed by “-A” are lead-free products.

UPD6P9 Datasheet(PDF) 39 Page - Renesas Technology Corp

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