MCP1641X datasheet(5/44 Pages) MICROCHIP

5 / 44 page

 2020-2021 Microchip Technology Inc. and its subsidiaries

DS20006394D-page 5

MCP1641X

Low Battery Output Low

Level

LBILOW

—0.4

—

ISINK = 2 mA (Note 4)

Start-up Time

—

EN low-to-high, 90% of VOUT

(Notes 3, 4)

Thermal Shutdown



Die Temperature

TSHDN

—140

—

C

Thermal Shutdown

Temperature Hysteresis

TSHDNHYS

—10—

C

Internal Overtemperature

Output

PGTOT

—75—

C

PGT signal switch from

high-to-low level,

MCP16411/2/3/4 only

AC/DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,

IOUT = 10 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Note 1: For VIN > VOUT, the device enters Automatic Input-to-Output Bypass mode, 

VOUT = VIN – RDS(ON)P * IOUT, maximum VIN is 5.25V.

2: VOUT pin is forced biased with a voltage higher than the nominal VOUT (device is not switching) at

IOUT = 0 mA. IQIN and IQOUT are the device’s current consumption at VIN and VOUT pins during Sleep

periods. The device selects its bias from VIN and/or VOUT.

3: 330

 resistive load, 3.3V VOUT (10 mA).

4: Determined by characterization, not production tested.

5: This is ensured by design.

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Temperature Range

-40

—

+125

°C

Steady state

Storage Temperature Range

-65

—

+150

°C

Maximum Junction Temperature

—

+150

°C

Transient

Package Thermal Resistances

Thermal Resistance, 10-Lead MSOP

JA

—71—

°C/W

Thermal Resistance, 10-Lead



3 mm x 3 mm TDFN

JA

—54—

°C/W

MCP1641X Datasheet(PDF) 5 Page - Microchip Technology

MCP1641X Datasheet(HTML) 5 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44

Datasheet Download

Link URL