 2019 Microchip Technology Inc.

DS20006084A-page 5

MIC4126/27/28

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Maximum Junction Temperature

TJ

—

—

+150

°C

—

Storage Temperature Range

TS

–65

—

+150

°C

—

Lead Temperature

—

—

—

+300

°C

10 sec.

Junction Operating Temperature

Range

TJ

–40

—

+125

°C

—

Package Thermal Resistances

Thermal Resistance, 3x3 VDFN 8-Ld

JA

—60

—

°C/W

—

Thermal Resistance, EP MSOP 8-Ld

JA

—60

—

°C/W

—

Thermal Resistance, EP SOIC 8-Ld

JA

—58

—

°C/W

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.