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SOLDER ABILITY

Item

Requirement

Test Condition

Solder ability

95%of immersed area

must show no voids , pin

holes.

Dip solder tails into the molten solder(held at

230±5°C) up to 0.5mm from the tip of tails for

3±0.5 seconds.

(MIL-STD-202 METHOD 208)

Resistance to

soldering heat

No melting, cracks or

functional damage allowed

All connectors designed for PCB soldering

within this specification must be able to

withstand the heat from solder oven according

to the graph below. The cycle should be

repeated twice.

(MIL-STD-202 METHOD 210)

Reflow Profile

Preheating temperature: 150 ~ 200°C, 60~120 seconds

Liquidus temperature (TL): 217°C, 60~150 seconds

Peak temperature: 260°C

Time within 5 °C of peak temperature (Tc): 255°C, 30seconds