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114B Datasheet(PDF) 3 Page - ATTEND Technology Inc. |
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114B Datasheet(HTML) 3 Page - ATTEND Technology Inc. |
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3 / 4 page ![]() The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有;非經同意,不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - ENVIRONMENTAL Item Requirement Test Condition Temperature Shock Finish 1.Contact Resistance: 50mΩ(Max) 2. InsulationResistance: 100MΩ(Min) Stage Temp Time t1 -55±5ºC 30 min t2 -55±5ºC ~+85±5ºC 5 min t3 +85±5ºC 30 min t4 +85±5ºC ~-55ºC±5ºC 5 min Test time: 5 cycles (MIL-STD-202 METHOD 107) Heat Resistance Finish 1.Contact Resistance: 50mΩ(Max) 2. InsulationResistance: 100MΩ(Min) Solder connectors on PCB and mate them together, expose to 85±2ºC for 48hrs. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 of 2hrs, after which the specified measurements shall be performed. (MIL-STD-202 METHOD 108) Humidity Finish 1.Contact Resistance: 50mΩ(Max) 2.InsulationResistance: 100MΩ(Min) Humidity storage at +40±3ºC with 90±5% RH for 96 hours. (EIA364-31) Salt Spray Finish 1.Contact Resistance: 50mΩ(Max) 2.No Damage 5 ± 1% salt solutions, at 35 ± 2ºC duration 24 hours. Connectors detached (MIL-STD-1344) |
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