MP6604A

– SIMPLE, DUAL H-BRIDGE DRIVER WITH SEPARATE IN AND EN PINS

MP6604A Rev. 1.1

MonolithicPower.com

5

5/12/2023

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ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) ......................-0.3V to +48V

VAOUT1, VAOUT2, VBOUT1, VBOUT2........-0.7V to +48V

VCP, VCPB ............................... …VIN to VIN + 6.5V

PGNDx to GND............................-0.3V to +0.3V

All other pins to GND ...................-0.3V to +6.5V

Continuous power dissipation (TA = 25°C) (2)

QFN-28 (4mmx5mm)

…………………….3.125W

TSSOP-28EP.

……………………..………...3.9W

Storage temperature ................ -55°C to +150°C

Junction temperature (TJ) .........................150°C

Lead temperature (solder) ........................260°C

ESD Ratings

Human body model (HBM) ........................ ±2kV

Charged device model (CDM)....................±2kV

Recommended Operating Conditions (3)

Supply voltage (VIN) .........................4.5V to 45V

PGNDx to GND............................-0.2V to +0.2V

Operating junction temp (TJ). ... -40°C to +125°C

Thermal Resistance (4)

θJA

θJC

QFN-28 (4mmx5mm).............40.........9.....°C/W

TSSOP-28EP.........................32.........6.....°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can produce an excessive die temperature, which

may cause the device to go into thermal shutdown. Internal

thermal

shutdown

circuitry

protects

the

device

from

permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.