Data Sheet S17384EJ1V0DS

21

µPD16312

13. RECOMMENDED SOLDERING CONDITIONS

The following conditions must be met for mounting conditions of the

µPD16312.

For more details, refer to the

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under

different conditions.

Type of Surface Mount Device

µPD16312GB-3B4, µPD16312GB-3BS: 44-pin plastic QFP (10 x 10)

Soldering process

Soldering conditions

Symbol

Infrared ray reflow

Peak package’s surface temperature: 235

°C or below,

Reflow time: 30 seconds or below (210

°C or higher),

Number of reflow process: MAX.3

IR35-00-2

VPS

Peak package’s temperature: 215

°C or below,

Reflow time: 25 to 40 seconds (200

°C or higher),

Number of reflow process: MAX.3

VP15-00-2

Wave Soldering

Solder temperature: 260

°C or below,

Flow time: 10 seconds or below

Temperature of pre-heat: 120

°C pr below (Plastic surface temperature)

Number of flow process: 1

WS60-00-1

Partial heating method

Terminal temperature: 300

°C or below,

Time 3 seconds or below (per side of pin position)

−

Caution Do not apply more than a single process at once, except for partial heating method.