Data Sheet S14288EJ1V0DS

17

µµµµPD16876

RECOMMENDED SOLDERING CONDITIONS

The

µPD16876 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended, contact your NEC sales representative.

Surface Mount Type

For the details of the recommended soldering conditions, refer to the document Semiconductor Device

Mounting Technology Manual (C10535E).

µµµµPD16876G

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher),

Count: two times, Exposure limit: Not limited

Note

IR35-00-2

VPS

Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher),

Count: two times, Exposure limit: Not limited

Note

VP15-00-2

Wave soldering

Solder bath temperature: 260°C Max., Time: 10 sec. Max., Count: once,

Exposure limit: not limited

Note

WS60-00-1

Partial heating

Pin temperature: 300°C Max., Time: 3 sec. Max., Exposure limit: not limited

Note



Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

Cautions Do not use different soldering methods together (except for partial heating).

REFERENCE

Quality Grades on NEC semiconductor Devices

C11531E

Semiconductor Device Mounting Technology Manual

C10535E

NEC Semiconductor Device Reliability/Quality Control System

C10983E

Semiconductor Selection Guide

X13769E