USBULC6-2F3

Ordering information

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Figure 17.

Flip-Chip tape and reel specifications

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available

at: www.st.com.

Note:

More information is available in the application notes:

AN2348: “400 µm Flip-Chip: Package description and recommendations for use”

AN1751: "EMI Filters: Recommendations and measurements"

4

Ordering information

5

Revision history

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 +/- 0.1

4 +/- 0.1

1.07

Ø 1.5 +/- 0.1

0.71

Part Number

Marking

Package

Weight

Base qty

Delivery mode

USBULC6-2F3

EH

Flip-Chip

1.16 mg

5000

Tape and reel (7”)

Date

Revision

Changes

15-Dec-2006

1

Initial release