USBULC6-2F3 datasheet(1/8 Pages) STMICROELECTRONICS

Part #	USBULC6-2F3

Description	Dual ultra low capacitance protection for high speed USB

PDF	8 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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1 / 8 page

December 2006

Rev 1

1/8

USBULC6-2F3

IPAD™

Dual ultra low capacitance protection for high speed USB

Main application

■ Hi-Speed USB port in wireless handsets (up to

480 Mb/s according to USB 2.0 High Speed

Specification)

Features

■ Ultra low diode capacitance (1.2 pF max)

■ Two data lines (D+ and D-) protected against

15 kV ESD

■ Breakdown Voltage VBR = 6.0 V min

■ Flip-Chip 400 µm pitch, lead-free

■ Very low leakage current

■ Very small PCB area

■ RoHS compliant

Description

The USBULC6-2F3 is a monolithic, application

specific discrete device dedicated to ESD

protection of high speed interfaces.

Its ultra low line capacitance secures a high level

of signal integrity without compromizing the

protection of downstream sensitive chips against

the most stringently characterized ESD strikes.

Benefits

■ Minimized impact on rise and fall times for

maximum data integrity

■ Low PCB space occupation

■ Higher reliability offered by monolithic

integration

Complies with the following standards:

Pin configuration (bump side)

Configuration

Order code

TM: IPAD is a trademark of STMicroelectronics

IEC 61000-4-2:

15 kV (air discharge)

8 kV (contact discharge)

MIL STD 883G - Method 3015.7

25 kV (Human body model)

Part Number

Marking

USBULC6-2F3

EH

Flip-Chip

(4 Bumps)

B

1

2

A

A2

A1

B2

B1

Note: B1 and B2 bumps must be

grounded on the PCB together

www.st.com

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USBULC6-2F3 Datasheet(PDF) 1 Page - STMicroelectronics

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