NCP3418, NCP3418A

http://onsemi.com

3

MAXIMUM RATINGS

Rating

Value

Unit

0 to 85

°C

0 to 150

°C

Package Thermal Resistance: SO−8

45

123

°C/W

°C/W

Package Thermal Resistance: SO−8 EP

50

°C/W

−65 to 150

°C

Lead Temperature Soldering (10 sec): Reflow (SMD styles only)

Standard (Note 3)

Lead Free (Note 4)

240 peak

260 peak

°C

JEDEC Moisture Sensitivity Level

SO−8 (240 peak profile)

SO−8 (260 peak profile)

SO−8 EP (240 peak profile)

SO−8 EP (260 peak profile)

1

1

1

3

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Internally limited by thermal shutdown, 150

°C min.

2. Rating applies when soldered to an appropriate thermal area on the PCB.

3. 60 − 180 seconds minimum above 183

°C.

4. 60 − 180 seconds minimum above 237

°C.

NOTE:

This device is ESD sensitive. Use standard ESD precautions when handling.

MAXIMUM RATINGS

Pin Symbol

Pin Name

Main Supply Voltage Input

15 V

−0.3 V

BST

Bootstrap Supply Voltage Input

30 V wrt/PGND

35 V

v 50 ns wrt/PGND, 15 V wrt/SW

−0.3 V wrt/SW

SW

Switching Node

(Bootstrap Supply Return)

30 V

−1.0 V DC

−10 V< 200 ns

DRVH

High−Side Driver Output

BST + 0.3 V

35 V

v 50 ns wrt/PGND, 15 V wrt/SW

−0.3 V wrt/SW

DRVL

Low−Side Driver Output

−0.3 V DC

−2.0 V < 200 ns

IN

DRVH and DRVL Control Input

−0.3 V

OD

Output Disable

−0.3 V

PGND

Ground

0 V

0 V

NOTE:

All voltages are with respect to PGND except where noted.