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FBL22033 Datasheet(PDF) 3 Page - NXP Semiconductors |
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FBL22033 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 14 page ![]() Philips Semiconductors Product specification FBL22033 3.3V BTL 8-bit latched/registered/pass-thru universal transceiver with 30 Ω termination 1999 Apr 15 3 PIN CONFIGURATION 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 BUS GND B1 BUS GND B2 BUS GND B3 BUS GND B4 BUS GND B5 BUS GND B6 BUS GND LOGIC GND AO1 AO2 AO3 LOOPBACK AI4 AI5 8-Bit Universal Transceiver FBL22033 52-lead PQFP AI2 AI3 AO4 AI6 LOGIC GND AO5 SG00092 DESCRIPTION The FBL22033 is an 8-bit transceiver featuring a split input (AI) and output (AO) bus on the TTL-level side. The common I/O, open collector B port operates at BTL signal levels. The logic element for data flow in each direction is controlled by two pairs of mode select inputs (SBA0 and SBA1 for B-to-A, SAB0 and SAB1 for A-to-B). It can be configured as a buffer, a register, or a D-type latch. When configured in the buffer mode, the inverse of the input data appears at the output port. In the flip-flop mode, data is stored on the rising edge of the appropriate clock input (LCAB or LCBA). In the latch mode, clock pins serve as transparent-High latch enables. Regardless of the mode, data is inverted from input to output. Data flow in the B-to-A direction, regardless of the logic element selected, is further controlled by the Loopback input. When the Loopback input is High the output of the selected A-to-B logic element (not inverted) becomes the B-to-A input. The 3-State AO port is enabled by asserting a High level on OEA. The B port has two output enables, OEB0 and OEB1. Only when OEB0 is High and OEB1 is Low is the output enabled. When either OEB0 is Low or OEB1 is High, the B-port is inactive and is pulled to the level of the pull-up voltage. New data can be entered in the flip-flop and latched modes or can be retained while the associated outputs are in 3-State (AO port) or inactive (B port). The B-port drivers are Low-capacitance open collectors with controlled ramp and are designed to sink 100mA. Precision band gap references on the B-port ensure very good noise margins by limiting the switching threshold to a narrow region centered at 1.55V. The B-port interfaces to “Backplane Transceiver Logic” (see the IEEE 1194.1 BTL standard). BTL features low power consumption by reducing voltage swing (1V p-p, between 1V and 2V) and reduced capacitive loading by placing an internal series diode on the drivers. BTL also provides incident wave switching, a necessity for high performance backplanes. Output clamps are provided on the BTL outputs to further reduce switching noise. The “VOH” clamp reduces inductive ringing effects during a Low-to-High transition. The “VOH” clamp is always active. The other clamp, the “trapped reflection” clamp, clamps out ringing below the BTL 0.5V VOL level. This clamp remains active for approximately 100ns after a High-to-Low transition. To support live insertion, OEB0 is held Low during power on/off cycles to ensure glitch- free B port drivers. Proper bias for B port drivers during live insertion is provided by the BIAS V pin when at a 3.3V level while VCC is Low. The BIAS V pin is a low current input which will reverse-bias the BTL driver series Schottky diode, and also bias the B port output pins to a voltage between 1.62V and 2.1V. This bias function is in accordance with IEEE BTL Standard 1194.1. If live insertion is not a requirement, the BIAS V pin should be tied to a VCC pin. The LOGIC GND and BUS GND pins are isolated inside the package to minimize noise coupling between the BTL and TTL sides. These pins should be tied to a common ground external to the package. Each BTL driver has an associated BUS GND pin that acts as a signal return path and these BUS GND pins are internally isolated from each other. In the event of a ground return fault, a “hard” signal failure occurs instead of a pattern dependent error that may be very infrequent and impossible to trouble- shoot. As with any high power device thermal considerations are critical. It is recommended that airflow (300Ifpm) and/or thermal mounting be used to ensure proper junction temperature. |
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