6.4 Thermal Information: OPA863A

THERMAL METRIC(1)

OPA863A

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

191.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

122.9

°C/W

RθJB

Junction-to-board thermal resistance

91.6

°C/W

ΨJT

Junction-to-top characterization parameter

65.5

°C/W

YJB

Junction-to-board characterization parameter

91.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2863A

THERMAL METRIC(1)

OPA2863A

UNIT

DSN (USON)

10 PINS

RθJA

Junction-to-ambient thermal resistance

52.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

41.7

°C/W

RθJB

Junction-to-board thermal resistance

25.5

°C/W

ΨJT

Junction-to-top characterization parameter

0.6

°C/W

YJB

Junction-to-board characterization parameter

25.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

8.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

OPA863A, OPA2863A

SBOSA95D – MAY 2022 – REVISED DECEMBER 2023

Copyright © 2023 Texas Instruments Incorporated

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Product Folder Links: OPA863A OPA2863A