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KMZ50 Datasheet(PDF) 3 Page - NXP Semiconductors |
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KMZ50 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1998 Mar 24 3 Philips Semiconductors Preliminary specification Magnetic field sensor KMZ50 CIRCUIT DIAGRAM LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). THERMAL CHARACTERISTICS SYMBOL PARAMETER MIN. MAX. UNIT VCC bridge supply voltage − 9V Ptot total power dissipation − 130 mW Tstg storage temperature −65 +150 °C Tbridge bridge operating temperature −40 +125 °C Iflip (max) maximum flipping current − 1500 mA Pflip (max) maximum flipping power dissipation − 50 mW Visol voltage between isolated systems: flip conductor - Wheatstone bridge − 60 V SYMBOL PARAMETER VALUE UNIT Rth j-a thermal resistance from junction to ambient 155 K/W Fig.2 Simplified circuit diagram. handbook, halfpage 87 6 5 12 3 4 MGD792 GND +VO +IF −IF −VO VCC n.c. n.c. Z1 |
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