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OM4068H/2 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # OM4068H/2
Description  LCD driver for low multiplex rates
PDF  28 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

OM4068H/2 Datasheet(HTML) 2 Page - NXP Semiconductors

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1998 Jun 18
2
Philips Semiconductors
Product specification
LCD driver for low multiplex rates
OM4068
FEATURES
• Single-chip LCD controller/driver
• Static/duplex/triplex drive modes with up to
32/64/96 LCD segments drive capability per device
• Selectable backplane drive configuration: static or
2 or 3 backplane multiplexing
• Selectable display bias configuration drive: static, 1⁄2 or
1
⁄3
• 32 segment drivers
• Serial data input (word length 32 to 96 bits)
• On-chip generation of intermediate LCD bias voltages
• 2 MHz fast serial bus interface
• CMOS compatible
• Compatible with any 4-bit, 8-bit or 16-bit
microprocessors/microcontrollers
• May be cascaded for large LCD applications
• Logic supply voltage range (VDD − VSS) of 2.5 to 5.5 V
• Display supply voltage range (VLCD − VSS) of
3.5 to 6.5 V
• Low power consumption, suitable for battery operated
systems
• No external components needed by the oscillator
• Manufactured in silicon gate CMOS process.
APPLICATIONS
• Telecom equipment
• Portable instruments
• Alarm systems
• Automotive equipment.
GENERAL DESCRIPTION
The OM4068 is a low-power CMOS LCD driver, designed
to drive Liquid Crystal Displays (LCDs) with low multiplex
rates. It generates the drive signals for any static or
multiplexed LCD containing up to three backplanes and up
to 32 segment lines and can be easily cascaded for larger
LCD applications. All necessary functions for the display
are provided in a single chip, including on-chip generation
of LCD bias voltages, resulting in a minimum of external
components and lower power consumption. A 3-line bus
structure enables serial data transfer with most
microprocessors/microcontrollers. All inputs are CMOS
compatible.
ORDERING INFORMATION
Notes
1. Gull Wing package.
2. For details see Chapter “Bonding pad locations”.
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
OM4068H(1)
QFP44
plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10
× 10 × 1.75 mm
SOT307-2
OM4068P
DIP40
plastic dual in-line package; 40 leads (600 mil)
SOT129-1
OM4068U/5(2)
die
unsawn wafer
−
OM4068U
tray
chip in tray
−



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