TMP114 datasheet(40/48 Pages) TI1

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9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, TMPx75 Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75

Form Factor and Pinout data sheet

• Texas Instruments, TMP275 ±0.5°C Temperature Sensor With I2C and SMBus Interface in Industry Standard

LM75 Form Factor and Pinout data sheet

• Texas Instruments, Design Considerations for Measuring Ambient Air Temperature application note

• Texas Instruments, Replacing Resistance Temperature Detectors with the TMP116 Temp Sensor application

note

• Texas Instruments, Temperature Sensors: PCB Guidelines for Surface Mount Devices application note

• Texas Instruments, Precise Temperature Measurements With the TMP116 and TMP117 application note

• Texas Instruments, Wearable Temperature Sensing Layout Considerations Optimized for Thermal Response

application note

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

SMBus™ is a trademark of Intel Corporation.

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE

REVISION

NOTES

January 2024

Initial Release

TMP119

SNIS236 – JANUARY 2024

www.ti.com

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