MF3DX3 datasheet(20/29 Pages) NXP

Part #	MF3DX3

Description	MIFARE DESFire EV3 contactless multi-application IC

PDF	29 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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20 / 29 page

NXP Semiconductors

MF3D(H)x3

MIFARE DESFire EV3 contactless multi-application IC

10 Package outline

UNIT

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUEDATE

IEC

JEDEC

JEITA

35.05

34.95

For unspecified dimensionsseePLLMC-drawing given in the subpackage code.

DIMENSIONS(mmare theoriginal dimensions)

SOT500-2

03-09-17

06-05-22

- - -

PLLMC:plasticleadlessmodule carrier package;35mmwide tape

SOT500-2

A(1)

max.

0.33

20mm

scale

detail X

Note

1. Total package thickness, exclusive punching burr.

Figure 4. Package outline SOT500-2 (MOA4)

MF3D_H_X3_SDS

All information provided in this document is subject to legal disclaimers.

Product short data sheet

Rev. 3.1 — 11 January 2024

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MF3DX3 Datasheet(PDF) 20 Page - NXP Semiconductors