TCS3200 datasheet(18/25 Pages) OSRAM

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ams Datasheet

Page 17

[v1-01] 2018-Mar-14

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TCS3200 − Manufacturing Information

The Plastic Small Outline IC package (D) has been tested and

has demonstrated an ability to be reflow soldered to a PCB

substrate.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The component should be limited to a maximum

of three passes through this solder reflow profile.

Figure 18:

TCS3200 Solder Reflow Profile

Figure 19:

TCS3200 Solder Reflow Profile Graph

Parameter

Reference

TCS32x0

Average temperature gradient in preheating

2.5°C/s

Soak time

tsoak

2 to 3 minutes

Time above 217°C

Max 60 s

Time above 230°C

Max 50 s

Time above Tpeak - 10°C

Max 10 s

Peak temperature in reflow

Tpeak

260°C (-0°C/5°C)

Temperature gradient in cooling

Max -5°C/s

Manufacturing Information

tsoak

Tpeak

Not to scale — for reference only

Time (s)

TCS3200 Datasheet(PDF) 18 Page - OSRAM GmbH