ams Datasheet

Page 27

[v1-01] 2018-Apr-23

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TSL2561 − Packaging Mechanical Data

Figure 27:

Package T - Six-Lead TMB Plastic Surface Mount Packaging Configuration

Note(s):

1. All linear dimensions are in millimeters. Dimension tolerance is ±0.20mm unless otherwise noted.

2. The photo-active area is 1398μm by 203μm.

3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is 0.5μm minimum of soft gold plated over a 18μm thick copper foil pattern with a 5μm to 9μm nickel barrier.

5. The underside of the package includes copper traces used to connect the pads during package substrate fabrication. Accordingly,

exposed traces and vias should not be placed under the footprint of the TMB package in a PCB layout.

6. This package contains no lead (Pb).

7. This drawing is subject to change without notice.

Packaging Mechanical Data

PACKAGE TMB-6

Six-Lead Surface Mount Device

PIN 1

0.31

1.90

2.60

3.80

1.35

0.90 TYP

0.90

TYP

0.30

TYP

0.60

TYP

0.30

TYP

TOP VIEW

BOTTOM VIEW

END VIEW

R 0.20

6 Pls

PIN 4

Lead Free

Pb

Photo-Active Area

TOP VIEW

0.50

0.88