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Datasheet, Public

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[v2-00] 2022-Nov-30

TSL2572 − Package Information

Figure 35:

Package FN — Dual Flat No-Lead Packaging Configuration

Note(s):

1. All linear dimensions are in micrometers.

2. The die is centered within the package within a tolerance of

± 75 μm.

3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

5. This package contains no lead (Pb).

6. This drawing is subject to change without notice.

Package Information

PACKAGE FN

Dual Flat No-Lead

203

+ 8

6 SDA

5 INT

4 NC

VDD 1

SCL 2

GND 3

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Lead Free

Pb

300

+ 50

650

BSC

2000

+ 100

2000

+ 100

PIN 1

PIN 1

END VIEW

650

+ 50

PIN OUT

TOP VIEW

750

+ 150

Photodiode Array Area

295

Nominal

355

+ 10

398

+ 10

CL of Solder Contacts

CL of Photodiode Array Area

(Note

2)

1 Nominal

CL of Solder Contacts

of Photodiode Array Area (Note

2)

CL

144 Nominal

Green

RoHS