Mounting:

• Tthe bottom dead center of the mounting head must be adjusted, so that it does not press on the PCB surface to avoid any punctual

pressure on component at pick & place.

• When a highly active halogenous (chlorine,bromine, etc.) flux is used, the residues of flux may negatively affect the resistor's

performance and reliability.

• The reflow soldering method shall be used.

• Be careful when picking up the resistors with tweezers, as the overcoat and/ or the body can chip-off.

• Ensure sufficient close up dimension, preventive maintenance and replacement of the centering jaw to avoid a crack when it is worn

out.

• The resistor temperature could exceed 155°C depending on the wiring pattern, heat dissipation from surrounding, etc., which is not

necessarily relevant related to the rated dissipation. It must be ensured in advance that the heat dissipation of the resistor does not

damage the PCB and any surrounding components.

• Support from the bottom side of the PCB by a support pin is required to minimize the impact energy from the mounting head.

• In case of manual soldering, the soldering tip shall not touch the product.

Adhesive:

• The adhesive should have a sufficient coating and viscosity and should harden rapidly.

• The adhesive should be strong enough to hold parts on the board during the mounting and solder process and should have sufficient

strength at high temperatures.

• The adhesive should have corrosion resistance, excellent insulation characteristics and no emission of toxic gasses or any effect on the

human body.

• Do not use too much adhesive to avoid pollution of the soldering pads.

Anti-pulse Characteristics:

• If transient overloads such as power pulse or voltage / current surges are applied to resistor products, their performance and reliability

may be degraded.

• Pay attention to discharges between terminations (arc-over) when high voltages are applied.

Soldering:

• The solder profile must comply with the Würth Elektronik technical soldering specification. All other profiles will void the warranty.

• All other soldering methods are at the customer’s own risk.

• Strong forces which may affect the coplanarity of the component’s electrical connection with the PCB (i.e. pins), can damage the part,

resulting in avoid of the warranty.

• Customer needs to ensure that the applied solder paste, the paste thickness and solder conditions are applicable to guarantee a

sufficient solder result according to the relevant criteria of IPC-A-610.

• Excessive amount of solder may lead to higher tensile force and chip cracking. Insufficient amount of solder may detach the resistor due

to defective contacts.

• Do not use excessive nor insufficient flux.

• Provide enough washing when water-soluble flux is used.

• A maximum of two reflow cycles is recommended.

Cleaning and Washing:

• Washing agents used during the production to clean the customer application might damage or change the characteristics of the wire

insulation body, the marking or the plating. Washing agent may have a negative effect on the long-term functionality of the product.

• Avoid halogen in the flux or any contaminated flux as well as excessively high ultrasonic cleaning.

Coating, molding and potting of the PCB:

• If the product is potted in the costumer application, the potting material might shrink or expand during and after hardening. Shrinking

could lead to an incomplete seal, allowing contaminants into the body and termination. Expansion could damage the body or

termination. We recommend a manual inspection after potting to avoid these effects.

• When coating and molding the PCB, the quality influence on the resistor must be verified.

• Coating is generally not restricted, but it has to be ensured, that the datasheet values are still met.

• Verify the curing temperature and ensure that there is no harmful decomposing or reaction gas emission during curing.

• When the resistor is coated, potted or molded, the curing stress could cause peeling of the protective coating layer and cracking of the

solder fillet, resulting in changes of the electrical and mechanical characteristics.

• If the resin is not 100% capable to prevent moisture diffusion, the electrical values or capabilities may change.

• Do not exceed the maximal temperature rise of 20°C.

Handling:

• After soldering, bending, twisting or distortion during the PCB handling and storage should be avoided.

• Excessive pressure during the functional check of the PCB should be avoided.

• Bending stress while breaking the PCB should be avoided.

• After mounting, piling the PCBs should be avoided, in order to prevent the chip resistor from hitting another board.

Disposal:

• Observe appropriate laws and regulations for handling and disposal of products or packaging materials.

These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.

However, no responsibility is assumed for inaccuracies or incompleteness. V2.0

Würth Elektronik eiSos GmbH & Co. KG

EMC & Inductive Solutions

Max-Eyth-Str. 1

74638 Waldenburg

Germany

Tel. +49 (0) 79 42 945 - 0

www.we-online.com

eiSos@we-online.com

CHECKED

REVISION

DATE (YYYY-MM-DD)

GENERAL TOLERANCE

PROJECTION

METHOD

FPu

001.000

2023-09-14

DIN ISO 2768-1m

DESCRIPTION

TECHNICAL REFERENCE

WRIS-RSKS Thick Film - Anti-

Sulfur General Purpose

KS04021001F110KAATH0000

ORDER CODE

560112110012

SIZE/TYPE

BUSINESS UNIT

STATUS

PAGE

0402

eiSos

Valid

8/9

This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH

& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation, transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic

component which is used in electrical circuits that require high safety and reliability functions or performance.