Technical Data

Data Sheet N0126, Rev. E

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30KPA SERIES

30KPA SERIES GLASS PASSIVATED

TRANSIENT VOLTAGE SUPPRESSOR

Notes: 1. Non-repetitive current pulse, per Fig. 3 and derated above TA = 25°C per Fig. 2.

2. Mounted on copper pad area of 0.8” × 0.8” (20 × 20mm)

3. 8.3ms single half sine wave, or equivalent square, duty cycle=4 pulses per minute maximum.

Features

Mechanical Data

Circuit Diagram

Maximum Ratings and Thermal Characteristics@TA=25°C unless otherwise specified

Parameter

Symbol

Value

Unit

Peak Pulse Power Dissipation on 10x1000μs

Waveform(Note 1)

PPPM

30000

W

Peak Pulse Current on 10x1000μs

Waveform(Note 1)

IPPM

See Table 1

A

Steady State Power Dissipation at TL=75°C Lead

Lengths .375”, (9.5mm)(Note 2)

PM(AV)

8.0

W

Peak Forward Surge Current, 8.3ms Sine-Wave

Superimposed on Rated Load, (JEDEC

Method)(Note 3)

IFSM

400.0

A

Typical Thermal Resistance Junction to Lead

RθJL

8.0

°C/W

Typical Thermal Resistance Junction to Ambient

RθJA

40

°C/W

Operating Junction and Storage

Temperature Range

TJ,TSTG

-55 to 175

°C



Case: Molded Plastic over glass passivated junction



Terminals: Plated Axial leads , Solderable per

MIL-STD 750, Method 2026



Polarity: Color Band denoted positive end (cathode)

except Bipolar



Mounting Position: Any



Weight:2.1 grams(approx.)

P-600



Plastic package has Underwriters Laboratory

Flammability Classification 94V-O



Glass Passivated Junction



30000W Peak Pulse Power Capability on 10/1000 μs

waveform



Voltage-28.0 to 400 Volts



Excellent Clamping Capability



Repetition rate (duty cycle): 0.05%



Low incremental surge resistance



Fast Response Time: typically less than 1.0 ps from

volts to BV



High temperature soldering guaranteed: 265℃/10

seconds/.375”, (9.5mm) lead length, 5lbs., (2.3kg) tension



This is a Pb − Free Device



All SMC Parts are Traceable to the Wafer Lot



Additional testing can be offered upon request