SP5T Monolithic Pin Diode Switch

MASW-005100-1194

Rev 1

5

ASSEMBLY INSTRUCTIONS

Cleanliness

These chips should be handled in a clean environment free of organic contamination.

Electro-Static Sensitivity

The MASW-00 Series PIN switches are ESD, Class 1A sensitive (HBM). The proper ESD handling

procedures must be used.

Wire Bonding

Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is

recommended. A stage temperature of 150°C and a force of 18 to 22 grams should be used.

Ultrasonic energy should be adjusted to the minimum required. RF bonds should be kept as short as

possible to minimize inductance.

Mounting

These chips have Ti-Pt-Au back metal. They can be die mounted with a 80Au/20Sn or electrically

conductive Ag epoxy. Mounting surface must be flat and clean of oils and contaminants.

Eu Eutectic Die Attachment

An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255°C

and a tool tip temperature of 265°C. When hot gas is applied, the tool tip temperature should be

290°C. The chip should not be exposed to temperatures greater than 320°C for more than 10

seconds. No more than three seconds should be required for the die attachment.

Epoxy Die Attachment

Assembly should be preheated to 125°C-150°C. A Controlled thickness of 2 mils is recommended for

best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the

chip after placement to ensure complete coverage. Cure epoxy per manufacturer’s recommended

schedule.