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FDN361 Datasheet(PDF) 1 Page - EVER SEMICONDUCTOR CO.,LIMITED |
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FDN361 Datasheet(HTML) 1 Page - EVER SEMICONDUCTOR CO.,LIMITED |
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1 / 5 page ![]() General Description These devices are particularly suited for low voltage applications in notebook computers, portable phones, PCMCIA cards, and other battery powered circuits where fast switching, and low in-line power loss are needed in a very small outline surface mount package. D S G Absolute Maximum Ratings TA=25 oC unless otherwise noted Symbol Parameter Ratings Units VDSS Drain-Source Voltage 30 V VGSS Gate-Source Voltage r 20 V ID Drain Current – Continuous (Note 1a) 1.4 A – Pulsed 10 Power Dissipation for Single Operation (Note 1a) 0.5 PD (Note 1b) 0.46 W TJ, TSTG Operating and Storage Junction Temperature Range –55 to +150 qC Thermal Characteristics RTJA Thermal Resistance, Junction-to-Ambient (Note 1a) 250 qC/W RTJC Thermal Resistance, Junction-to-Case (Note 1) 75 FDN361 SOT–23 1. GATE 2. SOURCE 3. DRAIN Rev:2023A2 1 Features VDS (V) = 30V RDS(ON) 110m (VGS = 10V) RDS(ON) 160m (VGS = 4.5V) |
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