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TUSB564 Datasheet(PDF) 48 Page - Texas Instruments |
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TUSB564 Datasheet(HTML) 48 Page - Texas Instruments |
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48 / 54 page ![]() 12.2 Mechanical Data NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. PACKAGE OUTLINE 4225901/A 05/2020 www.ti.com VQFN - 1 mm max height PLASTIC QUAD FLATPACK- NO LEAD RGF0040F A 0.08 C 0.1 C A B 0.05 C B SYMM SYMM 5.1 4.9 7.1 6.9 1 MAX 0.05 0.00 C SEATING PLANE 3.7±0.1 3.5 5.5 36X 0.5 5.7±0.1 40X 0.5 0.3 40X 0.3 0.2 1 12 13 20 21 32 33 40 41 PIN 1 INDEX AREA (0.2) TYP (0.16) 0.100 MIN (0.130) SECTION A-A TYPICAL TUSB564-Q1 SLLSFO9 – MAY 2024 www.ti.com 48 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TUSB564-Q1 |
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