SAA2003H datasheet(39/44 Pages) PHILIPS

39 / 44 page

May 1994

Philips Semiconductors

Preliminary speciﬁcation

Stereo ﬁlter and codec

SAA2003

SOLDERING

Plastic quad ﬂat-packs

BYWAVE

During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the

adhesive, the component can be soldered. The adhesive

can be applied by screen printing, pin transfer or syringe

dispensing.

Maximum permissible solder temperature is 260

°C, and

maximum duration of package immersion in solder bath is

10 s, if allowed to cool to less than 150

°C within 6 s.

Typical dwell time is 4 s at 250

°C.

A modified wave soldering technique is recommended

using two solder waves (dual-wave), in which a turbulent

wave with high upward pressure is followed by a smooth

laminar wave. Using a mildly-activated flux eliminates the

need for removal of corrosive residues in most

applications.

BY SOLDER PASTE REFLOW

Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be

applied to the substrate by screen printing, stencilling or

pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt, infrared, and

vapour-phase reflow. Dwell times vary between 50 and

300 s according to method. Typical reflow temperatures

range from 215 to 250

°C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 min at 45

°C.

REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

IRON OR PULSE

-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally

opposite, end pins. Apply the heating tool to the flat part of

the pin only. Contact time must be limited to 10 s at up to

300

°C. When using proper tools, all other pins can be

soldered in one operation within 2 to 5 s at between 270

and 320

°C. (Pulse-heated soldering is not recommended

for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO

packages, solder is applied to the substrate by dipping or

by an extra thick tin/lead plating before package

placement.

SAA2003H Datasheet(PDF) 39 Page - NXP Semiconductors

SAA2003H Datasheet(HTML) 39 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44

Datasheet Download

Link URL