Electronic Components Datasheet Search
  English  ▼

X  

SP6120EY/TR Datasheet(PDF) 20 Page - Sipex Corporation

Part # SP6120EY/TR
Description  Low Voltage, AnyFETTM, Synchronous,Buck Controller Ideal for 2A to 10A, High Performance, DC-DC Power Converters
PDF  22 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  SIPEX [Sipex Corporation]
Direct Link  http://www.sipex.com
Logo SIPEX - Sipex Corporation

SP6120EY/TR Datasheet(HTML) 20 Page - Sipex Corporation

Back Button SP6120EY/TR Datasheet HTML 14Page - Sipex Corporation SP6120EY/TR Datasheet HTML 15Page - Sipex Corporation SP6120EY/TR Datasheet HTML 16Page - Sipex Corporation SP6120EY/TR Datasheet HTML 17Page - Sipex Corporation SP6120EY/TR Datasheet HTML 18Page - Sipex Corporation SP6120EY/TR Datasheet HTML 19Page - Sipex Corporation SP6120EY/TR Datasheet HTML 20Page - Sipex Corporation SP6120EY/TR Datasheet HTML 21Page - Sipex Corporation SP6120EY/TR Datasheet HTML 22Page - Sipex Corporation  
Zoom Inzoom in Zoom Outzoom out
 20 / 22 page
background image
20
Date: 1/21/05
SP6120 Low Voltage, AnyFETTM, Synchronous, Buck Controller
© Copyright 2005 Sipex Corporation
Layout Guideline
PCB layout plays a critical role in proper func-
tion of the converters and EMI control. In switch
mode power supplies, loops carrying high di/dt
give rise to EMI and ground bounces. The goal
of layout optimization is to identify these loops
and minimize them. It is also crucial on how to
connect the controller ground such that its op-
eration is not affected by noise. The following
guideline should be followed to ensure proper
operation.
1. A ground plane is recommended for mini-
mizing noises, copper losses and maximizing
heat dissipation.
2. Connect the ground of feedback divider, com-
pensation components, oscillator resistor and
soft-start capacitor to the GND pin of the IC.
Then connect this pin as close as possible to
the ground of the output capacitor.
3. The VCC bypass capacitor should be right
next to the Vcc and GND pin.
4. The traces connecting to feedback resistor
and current sense components should be short
and far away from the switch node, and switch-
ing components.
5. Connect the PGND pin close to the source of
the bottom MOSFET, and the SWN pin to the
source of the top MOSFET. Minimize the
trace between GH/GL and the gates of the
MOSFETs. All of these requirements reduce
the impedance driving the MOSFETs. This is
especially important for the bottom MOSFET
that tends to turn on through its miller capaci-
tor when the switch node swings high.
6. Minimize the loop composed of input capaci-
tors, top/bottom MOSFETs and Schottky di-
ode, This loop carries high di/dt current. Also
increase the trace width to reduce copper
losses.
7. Maximize the trace width of the loop con-
necting the inductor, output capacitors,
Schottky diode and bottom MOSFET.
APPLICATIONS INFORMATION: Continued



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com