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SP6120EY/TR Datasheet(PDF) 20 Page - Sipex Corporation |
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SP6120EY/TR Datasheet(HTML) 20 Page - Sipex Corporation |
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20 / 22 page ![]() 20 Date: 1/21/05 SP6120 Low Voltage, AnyFETTM, Synchronous, Buck Controller © Copyright 2005 Sipex Corporation Layout Guideline PCB layout plays a critical role in proper func- tion of the converters and EMI control. In switch mode power supplies, loops carrying high di/dt give rise to EMI and ground bounces. The goal of layout optimization is to identify these loops and minimize them. It is also crucial on how to connect the controller ground such that its op- eration is not affected by noise. The following guideline should be followed to ensure proper operation. 1. A ground plane is recommended for mini- mizing noises, copper losses and maximizing heat dissipation. 2. Connect the ground of feedback divider, com- pensation components, oscillator resistor and soft-start capacitor to the GND pin of the IC. Then connect this pin as close as possible to the ground of the output capacitor. 3. The VCC bypass capacitor should be right next to the Vcc and GND pin. 4. The traces connecting to feedback resistor and current sense components should be short and far away from the switch node, and switch- ing components. 5. Connect the PGND pin close to the source of the bottom MOSFET, and the SWN pin to the source of the top MOSFET. Minimize the trace between GH/GL and the gates of the MOSFETs. All of these requirements reduce the impedance driving the MOSFETs. This is especially important for the bottom MOSFET that tends to turn on through its miller capaci- tor when the switch node swings high. 6. Minimize the loop composed of input capaci- tors, top/bottom MOSFETs and Schottky di- ode, This loop carries high di/dt current. Also increase the trace width to reduce copper losses. 7. Maximize the trace width of the loop con- necting the inductor, output capacitors, Schottky diode and bottom MOSFET. APPLICATIONS INFORMATION: Continued |
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