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MAX20044F Datasheet(PDF) 13 Page - Analog Devices

Part # MAX20044F
Description  Automotive Hi-Speed USB 2.0 Protectors
PDF  16 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

MAX20044F Datasheet(HTML) 13 Page - Analog Devices

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EN Input
EN
is an active-low enable input. Drive EN low for normal
operation and enable the protection switches. This allows
BUS power, D+, and D- USB signaling to pass through
the device if a fault is not present. Drive EN high to dis-
able the device.
The MAX20042F, MAX20043F, and MAX20044F devices
support USB OTG. With these units, disabling the device
through the EN pin disables the +5V BUS power switch, but
leaves the D+ and D- data switches closed. This allows for a
downstream device to assume the role of host when nego-
tiated per the USB Host Negotiation Protocol. In this mode,
the HVBUS, HVD+, and HVD- outputs continue to be pro-
tected and FAULT continues to assert normally in response
to overvoltage conditions on these pins.
Applications Information
Power-Supply Bypass Capacitor
Bypass HVBUS to GND with a 10µF and a 0.1µF ceramic
capacitor as close to the device as possible to provide
±15kV (HBM) ESD protection on the pin. If the power
source has significant inductance due to long lead length,
take care to prevent overshoots due to the LC tank circuit
and provide protection if necessary to prevent violation
of the +6V absolute maximum rating on BUS. Connect
a 100µF low-ESR ceramic capacitor from BUS to GND.
Connect a 0.1µF and 10µF ceramic capacitor from both
BUS and IN to GND. Place these components on the
same plane as the IC, close to the IN and GND pins.
Layout of USB Data Line Traces
USB Hi-Speed requires careful PCB layout with 90Ω
controlled-impedance matched traces of equal lengths.
Use LC tuning components on the data lines as shown in
the Typical Operating Circuit. The values of these com-
ponents are layout and captive-cable dependent. Contact
Analog Devices technical support for more detailed infor-
mation.
±15kV ESD Protection
As with all Analog Devices ICs, ESD-protection structures
are incorporated on all pins to protect against electrostatic
discharges encountered during handling and assembly.
The devices have extra protection against static electric-
ity. Analog Devices engineers have developed state-of-
the-art structures to protect against ESD of ±15kV at the
HVD+, HVD-, and HVBUS ports without damage. The
ESD structures withstand high ESD in all states: normal
operation, shutdown, and powered down. After an ESD
event, the devices keep working without latchup, whereas
other solutions can latch and must be powered down to
remove latchup. ESD protection can be tested in various
ways; this product is characterized for protection to the
following limits:
● ±15kV using the Human Body Model
● ±15kV using IEC 61000-4-2’s Air-Gap Discharge
method, EN = GND
● ±8kV using the Contact Discharge method specified
in IEC 61000-4-2, EN = GND
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Analog Devices for a reliability report that docu-
ments test setup, test methodology, and test results.
Human Body Model
Figure 8 shows the Human Body Model, and Figure 9
shows the current waveform it generates when discharged
into a low impedance. This model consists of a 100pF
capacitor charged to the ESD voltage of interest, which is
then discharged into the device through a 1.5kΩ resistor.
IEC 61000-4-2
The IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment. The MAX20042F,
MAX20043F, and MAX20044F devices help users design
equipment that meets Level 4 of IEC 61000-4-2. The
main difference between tests done using the Human
Body Model and IEC 61000-4-2 is higher peak current
in IEC 61000-4-2. Because series resistance is lower in
the IEC 61000-4-2 ESD test model (Figure 10), the ESD
withstand voltage measured to this standard is generally
lower than that measured using the Human Body Model.
Figure 11 shows the current waveform for the ±8kV, IEC
61000-4-2 Level 4, ESD Contact Discharge test. The
Air-Gap Discharge test involves approaching the device
with a charged probe. The Contact Discharge method
connects the probe to the device before the probe is
energized.
www.analog.com
Analog Devices │ 13
MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors



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