(All voltages referenced to GND.)

BUS, IN ...................................................................-0.3V to +6V

FAULT

, EN, D+, D-..................................................-0.3V to +6V

D+, D- to IN ........................................................................+0.3V

HVD+, HVD-, HVBUS ...........................................-0.3V to +18V

Continuous Power Dissipation (TA = +70°C)

16-Pin QSOP (derate 9.6mW/°C above +70°C).......771.5mW

Operating Temperature Range ........................ -40°C to +105°C

Storage Temperature Range............................ -65°C to +150°C

Junction Temperature......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

QSOP

Junction-to-Ambient Thermal Resistance (θJA) .....103.7°C/W

Junction-to-Case Thermal Resistance (θJC)...............37°C/W

(VBUS = 5.0V, VIN = +3.3V, TJ = TA = -40°C to +105°C. RL = ∞, unless otherwise noted. Typical values are at VEN = 0V or VEN = 3.3V

and TA = +25°C, unless otherwise noted.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

Power-Supply Range (BUS)

VBUS

4.75

5.5

V

Power-Supply Range (IN)

VIN

3.0

3.6

V

Input Current (BUS)

IBUS

VEN = 0V, IL = 0A, no fault

400

µA

Input Current (IN)

IIN

VEN = 0V, IL = 0A, no fault

10

µA

BUS Undervoltage Lockout

VUVLO

VBUS falling, Figure 1

3.85

4.2

4.55

V

BUS ANALOG SWITCH

HVBUS Protection Trip Threshold

VOV_BUS HVBUS rising, Figure 2

5.55

5.67

5.8

V

Voltage Protection Response Time

tFP_BUS

HVBUS rising, Figure 2

0.3

3.0

µs

Protection Recovery Time

tFPR_BUS HVBUS falling to below VOV_BUS, Figure 2

4.5

10

22

ms

HVBUS Short-to-Ground

Threshold

VSHRT

Figure 3

0.7

2.2

V

Short-to-Ground Response Time

tFPS

HVBUS falling to GND, Figure 3

0.3

1

µs

Short Detection Time

tSHRT_DET Enabled into short-to-ground

1

2

4

ms

On-Resistance

RON

VBUS = 5V, IBUS = 500mA (Note 2)

51

90

mΩ

Forward-Current Threshold

(Note 3)

ITHR

MAX20042F, Figure 4

0.57

0.65

0.73

A

MAX20043F, Figure 4

0.88

1.00

1.12

MAX20044F, Figure 4

1.14

1.30

1.46

Overcurrent Blanking Time

tBLANK

Figure 4 (Note 4)

0.35

1.2

2.8

ms

Overcurrent-Retry Blanking Time

tBLANK_RETRY Figure 4

12

ms

Overcurrent Autoretry Time

tRETRY

Figure 4

128

ms

Absolute Maximum Ratings

Electrical Characteristics

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

https://www.analog.com/en/resources/techni-

cal-articles/thermal-characterization-of-ic-packages.html.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

(Note 1)

Package Thermal Characteristics

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MAX20042F–MAX20044F

Automotive Hi-Speed USB 2.0 Protectors