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TMDS442PNPR Datasheet(PDF) 7 Page - Texas Instruments |
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TMDS442PNPR Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 45 page ![]() www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS THERMAL CHARACTERISTICS RECOMMENDED OPERATING CONDITIONS TMDS442 SLLS757A – AUGUST 2006 – REVISED MARCH 2007 over operating free-air temperature range (unless otherwise noted)(1) UNIT VCC Supply voltage range (2) –0.5 V to 4 V Aim*, Bim 2.5 V to 4 V Voltage range Yjm, Zjm, , Vsadjj, HPDi, 5V_SINKj, LC_SCL, LC_SDA, LC_A0, LC_A1, GE, GPIO –0.5V to 4 V SCLi, SCL_SINKj, SDAi, SDA_SINKj, HPD_SINKj, 5V_PWRi –0.5 V to 6 V Aim, Bim ±6 kV Human body model(3) All pins ±5 kV Electrostatic discharge Charged-device model(4) (all pins) ±1500 V Machine model (5) (all pins) ± 200 V See Dissipation Continuous power dissipation Rating Table (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. (3) Tested in accordance with JEDEC Standard 22, Test Method A114-B (4) Tested in accordance with JEDEC Standard 22, Test Method C101-A (5) Tested in accordance with JEDEC Standard 22, Test Method A115-A DERATING FACTOR (1) TA = 70°C PACKAGE PCB JEDEC STANDARD TA ≤ 25°C ABOVE TA = 25°C POWER RATING 128-TQFP PNP Low-K(2) 2129.47 mW 21.2947 mW/ °C 1171.20 mW 128-TQFP PNP High-K(3) 4308.48 mW 43.0848 mW/ °C 2369.66 mW (1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. (2) In accordance with the Low-K thermal metric definitions of EIA/JESD51-3 (3) In accordance with the High-K thermal metric definitions of EIA/JESD51-7 over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RθJB Junction-to-board thermal resistance 7.86 °C/W RθJC Junction- to-case thermal resistance 19.5 °C/W VIH = VCC, VIL = VCC - 0.6 V, RT = 50 Ω, AVCC = 3.3 V, VCC = 3.6 V, RVSADJ = 4.6 kΩ, PRE = Low or high PD Device power dissipation 1431 mW Ai/Bi(2:4)= 1.65 Gbps HDMI data pattern, Ai/Bi(1) = 165 MHz clock MIN NOM MAX UNIT VCC Supply voltage 3 3.3 3.6 V TA Operating free-air temperature 0 70 °C TMDS DIFFERENTIAL PINS (A/B) VIC Input common mode voltage VCC–400 VCC+10 mV VID Receiver peak-to-peak differential input voltage 150 1560 mVp-p RVSADJ Resistor for TMDS compliant voltage swing range 4.6 4.64 4.68 k Ω AVCC TMDS Output termination voltage, see Figure 3 3 3.3 3.6 V RT Termination resistance, see Figure 3 45 50 55 Ω Signaling rate 0 2.25 Gbps CONTROL PINS (LC_A0, LC_A1, GE, GPIO) VIH LVTTL High-level input voltage 2 VCC V 7 Submit Documentation Feedback |
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