11

LT1192

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

SI PLIFIED SCHE ATIC

+

–

LT1191 • TA14

+V

+V

3

2

1

8

5

BAL

BAL

SHDN

6

*

7

4

*SUBSTRATE DIODE, DO NOT FORWARD BIAS

PACKAGE DESCRIPTIO

J8 1298

0.014 – 0.026

(0.360 – 0.660)

0.200

(5.080)

MAX

0.015 – 0.060

(0.381 – 1.524)

0.125

3.175

MIN

0.100

(2.54)

BSC

0.300 BSC

(0.762 BSC)

0.008 – 0.018

(0.203 – 0.457)

0

° – 15°

0.045 – 0.068

(1.143 – 1.727)

FULL LEAD

OPTION

0.023 – 0.045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

0.045 – 0.065

(1.143 – 1.651)

0.005

(0.127)

MIN

0.405

(10.287)

MAX

0.220 – 0.310

(5.588 – 7.874)

12

3

4

87

65

0.025

(0.635)

RAD TYP

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

OBSOLETE PACKAGE

J8 Package

8-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)