Voltage Range on Any Pin Relative to GND........-0.5V to +4.0V

Maximum Current into Any Pin......................... -20mA to +20mA

Operating Temperature Range........................... -40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -40°C to +125°C

Lead temperature (soldering, 10s)..................................+300°C

Soldering Temperature (reflow).......................................+260°C

6 TDFN-EP

Package Code

T633+2

Outline Number

21-0137

Land Pattern Number

90-0058

Thermal Resistance, Single-Layer Board:

Junction to Ambient (θJA)

55°C/W

Junction to Case (θJC)

9°C/W

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

42°C/W

Junction to Case (θJC)

9°C/W

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to

https://www.analog.com/en/technical-articles/thermal-char-

acterization-of-ic-packages.html.

For the latest package outline information and land patterns (footprints), go to

https://www.analog.com/en/design-center/packaging-

quality-symbols-footprints/package-index.html. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package

drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.

Package Information

www.analog.com

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