Electronic Components Datasheet Search
  English  ▼

X  

PI3042A Datasheet(PDF) 2 Page - AMI SEMICONDUCTOR

Part # PI3042A
Description  Contact Image Sensor Chip
PDF  18 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  AMI [AMI SEMICONDUCTOR]
Direct Link  http://www.amis.com
Logo AMI - AMI SEMICONDUCTOR

PI3042A Datasheet(HTML) 2 Page - AMI SEMICONDUCTOR

  PI3042A Datasheet HTML 1Page - AMI SEMICONDUCTOR PI3042A Datasheet HTML 2Page - AMI SEMICONDUCTOR PI3042A Datasheet HTML 3Page - AMI SEMICONDUCTOR PI3042A Datasheet HTML 4Page - AMI SEMICONDUCTOR PI3042A Datasheet HTML 5Page - AMI SEMICONDUCTOR PI3042A Datasheet HTML 6Page - AMI SEMICONDUCTOR PI3042A Datasheet HTML 7Page - AMI SEMICONDUCTOR PI3042A Datasheet HTML 8Page - AMI SEMICONDUCTOR PI3042A Datasheet HTML 9Page - AMI SEMICONDUCTOR Next Button
Zoom Inzoom in Zoom Outzoom out
 2 / 18 page
background image
Preliminary PI3042A datasheet
PI3042A
400DPI CIS Sensor Chip
Engineering Data Sheet
Description:
Peripheral Imaging Corporation PI3042A CIS, Contact Image Sensor is a 400 dot per inch
(dpi) resolution, linear array image sensor chip. The sensor chip is processed using PIC’s
proprietary CMOS Image Sensor Technology. Designed for cascading multiple chips in a
series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a
printed circuit board (PCB). This bonding process allows users to produce variable CIS
module lengths in increments of chip array lengths. Hence, the wide variety of image reading
widths can easily be applied to the numerous document scanners, found in facsimile, as well
as, the narrow width scanners, such as, those found in check readers, lotto tickets, entrance
gate tickets and other office automation equipment which requires a wide variety of scanning
widths.
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 128 detector
elements, their associated multiplexing switches, buffers, and a chip selector. The detectors
element-to-element spacing is approximately 62.5 µm. The size of each chip without scribe lines is
8080 µm by 385 µm. Each sensor chip has 7 bonding pads. The pad symbols and functions are
described in Table 1.
Figure 1. PI3042A Block Diagram
SYMBOL
FUNCTION
SP
Start Pulse: Input clock to start the line scan.
CP
Clock Pulse: Input clock to clock of the Shift Register.
VDD
Positive Supply: +5 volt supply connected to substrate.
DGND
Digital Ground: Connection topside common
IOUT
Signal Current Output: Output for video signal current
AGND
Analog Ground: Connection topside common
EOS
End of Scan Pulse: Output from the shift register at end of scan.
8080µm
385µm
Buffer
SP
CP
VDD DGND
IOUT
AGND EOS
Chip
Select
Buffer
Readout Shift Register
Buffer
Row of 128 Sensors
and Video Signal
Multiplexers
Table 1. Pad Symbols and Functions
Page 2 of 18 Date: 09/23/05
125
126
127
128
1
2
3
4



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com