Second Setup: The CIS modules made with these devices operate in excess of 5.0 MHz.

Accordingly the wafer probe specifications are supplemented with high frequency clocking

performance using an A6 length modules PCB board.

The electro-optical characteristics of PI3042A imaging sensor chip are listed in Table 2. This is

Parameters

Symbols

Typical

Units

Notes

Number of Photo-elements

128

elements

Pixel-to-pixel spacing

~62.5

µm

Line scanning rate

128/Fclk

µs/line

Clock frequency

500

KHz

See note 2 for higher

clock speed.

(maximum 5 MHz)

Output voltage

1.8 ± 0.35

V

Output voltage non-uniformity

7.5

%

Dark output voltage

<100

mV

Dark output non-uniformity

<100

mV

Adjacent Pixel non-uniformity

<7.5

%

Chip-to-chip non-uniformity

7.5

%

Table 2. Electro-Optical Characteristic

Notes: (1)

Tint stands for the line scanning rate or the integration time. It is

determined by the time interval between two start pulses, where the start

pulses start the line-scan process, as soon as, CP, module clock, acquires

it and shifts it into the internal shift register. The minimum integration time

in a scan is determined by the number of pixels in the scan divided by the

clock frequency. In a CIS module it is the number of sensors times the

number of pixel in the sensor, all over the clock frequency. This time is

especially set for the wafer prober in order to calibrate the Vpavg, see

note (3).

(2)

Fclk is the device’s clock, CP, frequency and it is, also, equal to the pixel

rate. In the wafer test Fclk is set to 500 KHz. However, PIC (recently

acquired by AMIS) has been successfully mass-producing high frequency

CIS modules, using only the wafer test to qualify them. Hence, the device,

tested on an A6 size module’s PCB board at their standard high speed, is

specified.

(3)

Vpavg = Vp(n)/Npixels (average level in one line scan).

Npixels is the total number of pixels in sensor chip. Vpavg is converted from

impulse current video pixel into a voltage output. See Figure 4, Video Pixel

Output Structure in section Output Circuit Of The Image Sensor and Figure 5,

Video Output Test and Application Circuit in section Signal Conversion Circuit on

page 6 and 7. Vpavg is calibrated for each image sensor type because of probe

card variations, as well as, the interfacing circuits to the wafer probe machine.

Preliminary PI3042A datasheet

Page 7 of18 Date: 09/23/05