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TDA3668AT Datasheet(PDF) 4 Page - NXP Semiconductors |
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TDA3668AT Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 16 page ![]() 2000 Feb 01 4 Philips Semiconductors Preliminary specification Very low dropout voltage/quiescent current 5 V regulator with overvoltage switch off TDA3668AT FUNCTIONAL DESCRIPTION The TDA3668AT is a fixed 5 V regulator which can deliver output currents up to 100 mA. The regulator is available in an SO8 package. The regulator is intended for portable, mains, telephone and automotive applications. To increase the lifetime of batteries, a specially built-in clamp circuit keeps the quiescent current of this regulator very low, also in dropout and full load conditions. The regulator remains operational down to very low supply voltages and at lower voltages it switches off. A temperature protection circuit is included, which switches off the regulator output at a junction temperature above 150 °C. A new output circuit guarantees the stability of the regulator for a capacitor output circuit with an ESR up to 38 Ω. This is very attractive as the ESR of an electrolytic capacitor increases strongly at low temperatures (no expensive tantalum capacitor is required). A load dump circuit (see Fig.3) and an overvoltage protection circuit is built-in which will switch off the IC above 28 V (typical value). handbook, halfpage MGS590 tr VP (V) tf 50 14.4 t (ms) Fig.3 Load dump pulse. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). THERMAL CHARACTERISTICS QUALITY SPECIFICATION In accordance with “SNW-FQ-611E”. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage operating − 24 V load dump − 50 V VP(rp) reverse polarity supply voltage non-operating −−25 V Ptot total power dissipation temperature of PCB ground plane is 25 °C − 4.1 W Tstg storage temperature non-operating −55 +150 °C Tamb ambient temperature −40 +125 °C Tj junction temperature operating −40 +150 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in free air; soldered 125 K/W Rth(j-c) thermal resistance from junction to case to centre pins; soldered 30 K/W |
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