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IFN202 Datasheet(PDF) 2 Page - InterFET Corporation

Part # IFN202
Description  N-Channel JFET
PDF  6 Pages
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Manufacturer  INTERFET [InterFET Corporation]
Direct Link  http://www.interfet.com
Logo INTERFET - InterFET Corporation

IFN202 Datasheet(HTML) 2 Page - InterFET Corporation

  IFN202 Datasheet HTML 1Page - InterFET Corporation IFN202 Datasheet HTML 2Page - InterFET Corporation IFN202 Datasheet HTML 3Page - InterFET Corporation IFN202 Datasheet HTML 4Page - InterFET Corporation IFN202 Datasheet HTML 5Page - InterFET Corporation IFN202 Datasheet HTML 6Page - InterFET Corporation  
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https://www.InterFET.com
IFN201-A-2
Document Number: IF35115 Rev A01
InterFET Corporation
May, 2023
IFN201-A-2
InterFET
Product
Folder
Technical
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Electrical Characteristics
Static Characteristics (@ TA = 25°C, Unless otherwise specified)
Parameters
Conditions
IFN201A
IFN201
IFN202
Unit
Min
Max
Min
Max
Min
Max
V(BR)GSS
Gate to Source
Breakdown Voltage
VDS = 0V, IG = -1μA
-40
-40
-40
V
IGSS
Gate to Source
Reverse Current
VGS = -20V, VDS = 0V
-10
-10
-10
pA
VGS(OFF)
Gate to Source
Cutoff Voltage
VDS = 20V, ID = 10nA
-0.5
-1.0
-0.3
-1.5
-0.8
-4.0
V
IDSS
Drain to Source
Saturation Current
VGS = 0V, VDS = 20V
(Pulsed)
0.2
0.8
0.2
1
0.9
4.5
mA
Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified)
Parameters
Conditions
IFN201A
IFN201
IFN202
Unit
Min
Typ
Min
Typ
Min
Typ
GFS
Forward
Transconductance
VDS = 20V, VGS = 0V, f = 1kHz
500
500
1000
uS
GOS
Output Conductance
VDS = 20V, VGS = 0V, f = 1kHz
1
1
3.5
uS
Ciss
Input Capacitance
VDS = 20V, VGS = 0V, f = 1MHz
4
4
4
pF
Crss
Reverse Transfer
Capacitance
VDS = 20V, VGS = 0V, f = 1MHz
1
1
1
pF
en
Noise Voltage
VDS = 10V, VGS = 0V, f = 1kHz
3
3
3
nV/√Hz
Maximum Ratings (@ T
A
= 25°C, Unless otherwise specified)
Parameters
SOT-23
Unit
VRGS Reverse Gate Source and Gate Drain Voltage
-40
V
IFG
Continuous Forward Gate Current
50
mA
PD
Continuous Device Power Dissipation1
350
mW
P
Power Derating1
2.8
mW/°C
TJ
Operating Junction Temperature
-55 to 150
°C
TSTG Storage Temperature
-55 to 150
°C
1 Thermal power dissipation and derating values obtained with gate pin (substrate) thermally connected to pad and/or internal layer.



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