MP28162 – SINGLE-INDUCTOR, BUCK-BOOST CONVERTER WITH 1.5A MOSFETS

MP28162 Rev. 1.0

MonolithicPower.com

17

3/16/2023

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PCB Layout Guidelines

Efficient

PCB

layout

is

critical

for

stable

operation. Poor layout can result in reduced

performance, excessive EMI, resistive loss, and

system instability. For the best results, refer to

Figure 3 and follow the guidelines below:

1. Place CIN and COUT close to VIN, VOUT,

and PGND.

2. Place the VCC decoupling capacitor close

to VCC and AGND.

3. Keep the feedback resistor divider very

close to FB.

4. Keep the feedback trace far away from

noise sources such as SW1 and SW2.

5. Use wide copper layout for GND, VIN, and

VOUT to conduct current and decrease the

case temperature rise.

6. Place vias in the GND copper around the

chip to improve thermal performance.

VIN

VOUT

GND

Top Layer

SW2 SW1

GND

Bottom Layer

Figure 3: Recommended PCB Layout