TC7135

DS21460C-page 18

 2004 Microchip Technology Inc.

28-Lead Plastic Dual In-line (PI) – 600 mil (PDIP)

15

10

5

15

10

5

β

Mold Draft Angle Bottom

15

10

5

15

10

5

α

Mold Draft Angle Top

17.27

16.51

15.75

.680

.650

.620

eB

Overall Row Spacing

§

0.56

0.46

0.36

.022

.018

.014

B

Lower Lead Width

1.78

1.27

0.76

.070

.050

.030

B1

Upper Lead Width

0.38

0.29

0.20

.015

.012

.008

c

Lead Thickness

3.43

3.30

3.05

.135

.130

.120

L

Tip to Seating Plane

37.21

36.32

35.43

1.465

1.430

1.395

D

Overall Length

14.22

13.84

12.83

.560

.545

.505

E1

Molded Package Width

15.88

15.24

15.11

.625

.600

.595

E

Shoulder to Shoulder Width

0.38

.015

A1

Base to Seating Plane

4.06

3.81

3.56

.160

.150

.140

A2

Molded Package Thickness

4.83

4.45

4.06

.190

.175

.160

A

Top to Seating Plane

2.54

.100

p

Pitch

28

28

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

2

1

D

n

E1

c

β

eB

E

α

p

L

A2

B

A1

A

B1

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MO-011

Drawing No. C04-079

§ Significant Characteristic